Overview of aluminum nitride ceramics

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of aluminum nitride ceramics

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(ALN Package Ceramic Substrate Electronics High Thermal Conductivity Aluminum Nitride Ceramic Parts Sheet)

Specifications of ALN Package Ceramic Substrate Electronics High Thermal Conductivity Aluminum Nitride Ceramic Parts Sheet

The ALN Bundle Porcelain Substratum Electronic Devices High Thermal Conductivity Aluminum Nitride Porcelain Components Sheet supplies reliable efficiency for innovative electronic applications. The product is aluminum nitride (AlN), a ceramic recognized for excellent thermal monitoring. It has a pureness level above 99%, making sure minimal pollutants for consistent procedure. Thermal conductivity reaches 170-180 W/m · K, surpassing many conventional ceramics. This allows efficient heat dissipation in high-power gadgets.

The product provides strong electrical insulation, with a dielectric stamina over 15 kV/mm. It protects against present leak sought after settings. Thickness alternatives array from 0.25 mm to 3.0 mm, sustaining varied design requirements. Personalized dimensions are readily available for specialized tasks. Surface area coating is smooth, with roughness below 0.4 µm. This ensures proper bonding with circuits or layers.

Running temperatures span from -50 ° C to 500 ° C, making it ideal for severe problems. It stands up to thermal shock, keeping structural honesty during fast temperature shifts. The product withstands chemical rust from acids, alkalis, and solvents. This expands life expectancy in extreme commercial settings.

Applications include power components, LED substrates, semiconductor packaging, and RF parts. It is ideal for electric vehicles, aerospace systems, and renewable energy technology. The low thermal expansion coefficient matches materials like silicon. This lowers stress in layered assemblies.

Customized shapes and holes are possible through laser cutting or precision machining. Metallization layers (gold, silver, light weight aluminum) are optional for enhanced solderability. The item satisfies RoHS and REACH criteria, ensuring environmental compliance.

Benefits consist of longer device life-span, secure signal transmission, and minimized overheating threats. It changes larger steels or less efficient porcelains in heat-sensitive designs. Rigorous top quality checks ensure harmony in thickness, measurements, and performance.

The ALN ceramic sheet sustains miniaturization trends in electronic devices by making it possible for small, high-power remedies. Its mix of thermal and electric homes makes it a sensible option for contemporary design obstacles.

(ALN Package Ceramic Substrate Electronics High Thermal Conductivity Aluminum Nitride Ceramic Parts Sheet)

Applications of ALN Package Ceramic Substrate Electronics High Thermal Conductivity Aluminum Nitride Ceramic Parts Sheet

The ALN package ceramic substratum is a high-performance product developed for innovative electronics. It utilizes light weight aluminum nitride (AlN) ceramic, known for extraordinary thermal conductivity. This property makes it suitable for managing warmth sought after applications. The material efficiently moves heat far from delicate elements, protecting against overheating and making sure reliable procedure.

These ceramic components are commonly used in power electronic devices. They function as substratums for circuits in devices like LED lighting systems, power components, and semiconductor devices. Their capacity to deal with heats and electrical insulation homes make them suitable for commercial and auto applications. In electric vehicles, they improve battery performance and durability by keeping secure thermal conditions.

The high thermal conductivity of light weight aluminum nitride (up to 170-200 W/mK) outmatches traditional products like alumina. This enables compact layouts without compromising warm dissipation. The ceramic sheets are also resistant to chemical rust and mechanical wear, making certain durability in rough atmospheres. Industries like aerospace and renewable energy count on them for crucial systems calling for precision and reliability.

Manufacturers benefit from the material’s compatibility with thin-film and thick-film modern technologies. It supports exact circuit printing and combination with metals like copper or gold. Customized sizes and shapes are possible with advanced machining, conference particular job demands. The low thermal development coefficient of ALN ceramics reduces tension throughout temperature level changes, lowering the threat of component failing.

In consumer electronic devices, these substrates enhance the performance of high-power LEDs and RF devices. They guarantee consistent illumination and signal security by successfully taking care of warmth. Clinical tools additionally utilizes ALN ceramics for imaging systems and sensors, where accuracy and thermal control are important.

The ALN package ceramic substratum is a functional option for modern-day thermal management challenges. It incorporates high thermal conductivity with electric insulation and mechanical strength. Industries adopt it to enhance performance, decrease downtime, and expand the life-span of digital systems.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.(nanotrun@yahoo.com)

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T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of ALN Package Ceramic Substrate Electronics High Thermal Conductivity Aluminum Nitride Ceramic Parts Sheet

1. What is ALN ceramic substrate?
ALN stands for aluminum nitride. It is a ceramic material used in electronics. It manages heat well. High thermal conductivity makes it ideal for devices needing heat control. It works better than many traditional materials.

2. Why pick ALN over alumina ceramic?
ALN has higher thermal conductivity. Alumina conducts heat less effectively. ALN moves heat away faster. This prevents overheating in high-power devices. ALN also resists electrical current better. It suits advanced electronics better.

3. How does high thermal conductivity help?
Heat builds up in electronics during use. ALN moves heat away from parts quickly. This stops components from getting too hot. It improves device reliability. It extends the lifespan of the product.

4. Where is ALN ceramic substrate used?
It is common in LED lighting systems. It is used in power modules and semiconductor devices. Circuits needing precise temperature control use it. High-frequency communication equipment also uses ALN.

5. Any handling tips for ALN sheets?
ALN is brittle like most ceramics. Handle it carefully to avoid cracks. Use proper cutting tools during installation. Avoid sudden temperature changes. Follow manufacturer guidelines for mounting. This prevents mechanical stress damage.

(ALN Package Ceramic Substrate Electronics High Thermal Conductivity Aluminum Nitride Ceramic Parts Sheet)