Overview of aluminum nitride ceramics

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of aluminum nitride ceramics

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(0.635mm Thickness Aluminum Nitride Ceramic Plate AlN Ceramic PCB Substrate Sheet)

Specifications of 0.635mm Thickness Aluminum Nitride Ceramic Plate AlN Ceramic PCB Substrate Sheet

The 0.635 mm density light weight aluminum nitride ceramic plate (AlN ceramic PCB substratum sheet) is created for high-performance digital applications. The product incorporates outstanding thermal conductivity with strong electric insulation. Its thermal conductivity gets to 170-180 W/m · K, making it ideal for heat dissipation in power electronic devices. The plate runs accurately in temperature levels from -50 ° C to 1000 ° C, making certain security in severe settings. Electrical insulation goes beyond 15 kV/mm, protecting against current leak in circuits. The 0.635 mm thickness supplies a balance between mechanical toughness and portable style, ideal for modern-day miniaturized gadgets. Surface roughness is kept below 0.2 μm, making certain smooth combination with circuit layers. The material’s coefficient of thermal growth (CTE) carefully matches silicon, reducing tension in semiconductor product packaging. AlN ceramic resists chemical deterioration from acids and alkalis, prolonging component life-span. It is lead-free and RoHS-compliant, fulfilling worldwide environmental criteria. The plate is compatible with thin-film and thick-film metallization procedures, making it possible for specific circuit patterning. It supports high-frequency signal transmission with minimal loss, critical for RF and microwave applications. Flexural toughness exceeds 300 MPa, preventing splits under mechanical lots. The dielectric constant is reduced (8.8-9.2 at 1 MHz), minimizing signal hold-up. Dielectric loss stays below 0.0003, guaranteeing power efficiency. AlN ceramic exceeds alumina and beryllia in thermal management, with more secure handling than beryllia. Applications consist of LED substrates, power components, laser diode providers, and vehicle electronics. The 0.635 mm thickness is a conventional choice, adjustable for particular demands. It is made by means of hot pushing or tape spreading, guaranteeing uniform thickness. Exact machining enables limited tolerances ( ± 0.02 mm) on dimensions. The material is non-porous, stopping wetness absorption in humid conditions. AlN ceramic plates are packaged in anti-static products to avoid contamination. Managing suggestions include using gloves to prevent surface oils. The item is examined for thermal shock resistance, surviving rapid temperature adjustments without cracking.

(0.635mm Thickness Aluminum Nitride Ceramic Plate AlN Ceramic PCB Substrate Sheet)

Applications of 0.635mm Thickness Aluminum Nitride Ceramic Plate AlN Ceramic PCB Substrate Sheet

The 0.635 mm thickness light weight aluminum nitride (AlN) ceramic plate functions as a high-performance product for requiring commercial applications. This AlN ceramic PCB substrate sheet incorporates thermal conductivity, electric insulation, and mechanical security. It is suitable for usage in power electronic devices, LED systems, and high-frequency gadgets.

Aluminum nitride ceramic plates efficiently manage warm in electronic parts. The 0.635 mm thickness equilibriums stamina and thermal transfer. It transfers warm faster than several standard porcelains. This minimizes overheating risks in circuits. It sustains high-power tools like IGBT components and motor controllers.

The product’s low thermal expansion matches silicon. This compatibility avoids stress splits in semiconductor packaging. It guarantees reliability in temperature-sensitive atmospheres. AlN ceramic plates are used in laser diodes and RF amplifiers. They preserve stability under fast temperature level changes.

AlN ceramic resists chemical rust and radiation. This makes it suitable for aerospace and automotive systems. It carries out dependably in harsh conditions. The 0.635 mm thickness provides sturdiness without adding bulk. It is utilized in slim, light-weight layouts for contemporary electronic devices.

The ceramic plate serves as an electric insulator. It avoids current leak in high-voltage applications. Its dielectric strength supports high-frequency signal integrity. This is important for 5G interaction equipment and radar systems. The product decreases signal loss at high regularities.

LED suppliers utilize AlN substratums for warm dissipation. The 0.635 mm density permits compact LED module designs. It extends LED lifespan by maintaining steady operating temperatures. AlN ceramic sheets are likewise utilized in power converters and solar inverters. They take care of high power densities without deteriorating.

Machining the 0.635 mm AlN ceramic plate calls for precision. It can be laser-cut or pierced for personalized layouts. The surface accepts metallization for circuit printing. This versatility sustains complex PCB layouts. It works with gold, silver, or copper layers.

Aluminum nitride ceramic is safe and eco stable. It meets RoHS and REACH compliance requirements. The 0.635 mm thickness aligns with industry specifications for multilayer PCBs. It is an economical option for high-reliability applications.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.(nanotrun@yahoo.com)

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of 0.635mm Thickness Aluminum Nitride Ceramic Plate AlN Ceramic PCB Substrate Sheet

What is the 0.635mm Aluminum Nitride Ceramic Plate used for? The plate is mainly used in high-power electronics, LED lighting, and RF components. It works for circuits needing fast heat transfer. The material’s high thermal conductivity moves heat away from sensitive parts. Its electrical insulation stops current leakage. Industries like aerospace, automotive, and telecom rely on it for thermal management in tight spaces.

Why choose 0.635mm thickness for AlN Ceramic PCB? The thickness balances strength and heat performance. Thinner plates may break under stress. Thicker ones add weight and cost. The 0.635mm size handles heat well without losing durability. It fits small devices needing reliable cooling. This makes it common in microelectronics and power modules.

How to handle and install the AlN Ceramic Plate? Avoid dropping or bending the plate. Use tools designed for fragile materials. Clean surfaces before attaching components. Apply epoxy or solder made for ceramics. Pressure or heat must stay within limits. Handle edges gently to prevent cracks. Follow manufacturer guidelines for temperature ranges.

Can the plate be customized for specific needs? Yes. Manufacturers cut it into shapes or sizes. Holes or grooves can be added. Metal layers or coatings improve performance. Custom features depend on the application. Check with suppliers for options like surface finishes or markings. Lead times vary with complexity.

How does AlN compare to Alumina or Beryllium Oxide? AlN conducts heat better than Alumina. It works near Beryllium Oxide’s level without toxic risks. AlN costs more than Alumina but lasts longer in high-power setups. It resists thermal shock better than both. AlN is safer than Beryllium Oxide. It suits environments needing non-hazardous materials.

(0.635mm Thickness Aluminum Nitride Ceramic Plate AlN Ceramic PCB Substrate Sheet)