Overview of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

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Specifications of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

This Energetic Metal Brazing Copper Coated Light Weight Aluminum Nitride Porcelain Sheet (AlN Substratum) uses a leading option for requiring electronic devices requiring significant warm management. Light Weight Aluminum Nitride (AlN) ceramic is the core product. It gives superb thermal conductivity. This suggests heat actions away from warm components really fast. The thermal conductivity is generally in between 170 and 200 W/mK. This keeps delicate components cooler. It enhances gadget dependability and lifespan.

A thick copper layer is adhered straight onto the AlN ceramic surfaces. We utilize the Active Steel Brazing (AMB) process. This process creates a strong, dependable bond in between the copper and the ceramic. The bond is metallurgical. It is much more powerful than older approaches. The copper layer is thick. It permits easy attachment of power semiconductors or various other parts using standard soldering. The copper additionally spreads warm well.

The AMB AlN substrate serves as a solid electrical insulator. It prevents electrical shorts. The ceramic has a high dielectric stamina. It endures high voltages. The product takes care of high temperatures well. It operates reliably in difficult conditions. The framework is mechanically durable. It resists thermal stress and anxiety. This prevents splitting during temperature adjustments.

These sheets come in various conventional dimensions. Custom dimensions are feasible. Common densities exist for the ceramic core and copper layers. The copper surface area can be finished various methods. Choices include bare copper, nickel plating, or nickel-gold plating. This protects the copper and help soldering. The AMB process guarantees a level, smooth surface area. This is important for precise setting up.

Use this AMB Copper Coated AlN Sheet in power modules, high-brightness LEDs, RF/microwave packages, and automotive electronics. It is suitable anywhere efficient warmth removal is vital. It deals with high power density. It makes certain steady efficiency.

(Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate)

Applications of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

Energetic steel brazing AMB copper covered light weight aluminum nitride ceramic sheets solve hard issues in electronics. These AlN substrates handle extreme warmth quite possibly. They additionally relocate warmth far from sensitive parts quickly. This matters a great deal in high-power gadgets. The strong copper layer bonds directly to the ceramic via unique AMB handling. This creates a very trusted link. It will not split easily under tension or temperature level swings.

Power electronics require this performance. Electric autos and industrial motor drives generate intense warm. These AlN substrates with copper take that heat. They draw heat far from IGBTs and SiC power components fast. This keeps the electronics cooler. Cooler parts last longer and function better. The aluminum nitride underneath the copper quits electricity from leaking. This stops brief circuits. It’s a safe, solid base.

LED lighting systems additionally benefit. High-brightness LEDs obtain very warm. Warm eliminates LED efficiency and life expectancy. The AMB AlN sheet spreads warm efficiently from the LED chip. This warmth goes into the metal base or colder. The outcome is brighter light for longer periods. The copper surface area makes affixing wires simple.

RF and microwave tools make use of these sheets as well. Signals travel quickly and clean across the copper circuits. The AlN below absorbs almost no signal power. This implies much less power loss. Components like radar systems and interaction equipment work much better. Stability is essential at high frequencies. This material supplies it.

Sensor packages need protection and good heat flow. Harsh settings damage sensing units. The ceramic sheet shields delicate components. It also relocates warmth away accurately. This maintains sensors exact. Medical imaging tools and factory sensors use this innovation. The strong copper-ceramic bond survives requiring conditions.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Active Metal Brazing Amb Copper Coated Aluminum Nitride Ceramic Sheet Aln Substrate

This ceramic sheet bonds copper to aluminum nitride using active metal brazing. People often ask these questions.

What is this material? It’s an AlN ceramic base. A copper layer is strongly stuck to it using a special high temperature AMB process. This creates a solid, reliable piece.

Why pick AMB copper on AlN? This method gives a very strong bond. The copper won’t peel off easily. It handles high heat well. It moves heat away from hot spots fast. This is crucial for powerful electronics. The AlN ceramic underneath is also an excellent heat spreader.

Where do we use these sheets? They go into places needing top heat control. Power modules use them. Electric vehicle parts use them. High-brightness LED lights use them. RF and microwave devices use them. Any gadget needing heat moved away fast uses them.

How well does it move heat? The AlN ceramic moves heat exceptionally well. The thick copper layer moves heat exceptionally well too. Together, they pull heat away from critical parts very effectively. This keeps electronics cooler. Cooler electronics last longer and work better.

What sizes and shapes exist? Factories make many standard sizes. Common thicknesses are available. They can also make custom sizes. They can make custom shapes for specific needs. Ask about your required dimensions. Production can usually match them.

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