Overview of aluminum nitride ceramics

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of aluminum nitride ceramics

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264)

Specifications of Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264

The Manufacturing Facility Straight Heat Resistance AIN Porcelain Sheet is a precision-engineered Light weight aluminum Nitride substratum made for requiring applications such as IGBT TO264 modules. This ceramic sheet delivers remarkable thermal monitoring and electrical insulation in high-power digital systems. The product make-up ensures security under extreme conditions, making it ideal for industrial and vehicle environments.

The ceramic sheet provides a thermal conductivity of 170-200 W/m · K, allowing efficient heat dissipation from high-density electronic elements. Its operating temperature level variety covers from -40 ° C to 800 ° C, maintaining architectural stability and performance without destruction. The reduced thermal expansion coefficient matches closely with silicon, lowering stress at product interfaces during fast temperature level adjustments.

Dimensions are customizable to fit particular requirements, with standard thickness choices from 0.25 mm to 1.5 mm. Surface roughness is controlled below Ra 0.4 μm for ideal bonding with metalized layers or semiconductor tools. The product achieves a dielectric stamina surpassing 15 kV/mm, ensuring dependable electric isolation in high-voltage circuits.

Mechanical residential properties include a flexural toughness of 300-400 MPa, supplying durability during handling and setting up processes. The ceramic sheet is chemically inert, standing up to deterioration from acids, alkalis, and organic solvents. This makes it suitable for harsh functional environments needing long-lasting dependability.

Applications prolong past IGBT modules to consist of LED product packaging, laser diode providers, and power semiconductor product packaging. The item is made making use of pressureless sintering technology, ensuring uniform thickness and minimal porosity. X-ray assessment and ultrasonic testing are executed during manufacturing to find internal defects, guaranteeing consistent high quality.

Custom metalization layers (light weight aluminum, copper, or gold) are offered for soldering or wire bonding demands. Tolerances for monotony and parallelism are maintained within ± 0.5% to make certain compatibility with automated setting up systems. The ceramic sheets are packaged in anti-static materials to avoid contamination throughout transportation and storage.

Factory-direct prices removes intermediary prices, using competitive prices for mass orders without endangering worldly top quality. Manufacturing preparation are maximized for quick turnaround, sustaining both prototyping and large-scale production demands. Technical documentation, consisting of material test reports and RoHS conformity certifications, goes along with each delivery.

This Light weight aluminum Nitride ceramic substrate fulfills the evolving demands of innovative power electronics, combining high-performance features with producing flexibility.

(Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264)

Applications of Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264

Factory Direct Heat Resistance AIN Ceramic Sheets (Light Weight Aluminum Nitride) are crafted for demanding applications in power electronics. These ceramic substrates excel in thermal monitoring. They are widely used in IGBT TO264 modules. IGBT modules deal with high power degrees in commercial systems. Efficient heat dissipation is important. AIN ceramic sheets transfer heat efficiently. This protects against overheating. Device reliability improves. Performance remains steady under severe conditions.

The high thermal conductivity of AIN ceramics makes them excellent for electrical automobile parts. EV power systems produce significant warm throughout operation. AIN substratums manage this warm efficiently. They guarantee longer life-span for inverters and motor controllers. Electrical insulation is an additional crucial benefit. AIN porcelains isolate circuits while conducting heat. This double feature minimizes part failure risks.

Renewable energy systems likewise gain from AIN ceramic sheets. Solar inverters and wind generator converters count on IGBT components. High-temperature environments test these systems. AIN substrates maintain structural stability at raised temperature levels. They resist thermal shock. Abrupt temperature level modifications do not create cracks. This toughness sustains continual procedure in solar farms and wind parks.

Industrial electric motor drives utilize IGBT components for speed control. Warm buildup can degrade electric motor performance. AIN ceramic sheets carry warmth away from sensitive components. This keeps ideal electric motor performance. Manufacturing tools operates much longer without shutdowns. Maintenance prices reduce. Performance boosts.

AIN ceramic substrates suit high-frequency power devices. Radiofrequency and microwave systems require low signal loss. The product’s dielectric buildings decrease energy dissipation. Signal clarity boosts. This is vital for interaction framework and radar systems.

Factory-direct manufacturing makes certain regular quality. Customized dimensions and densities are available. This flexibility fulfills particular style needs. Price savings come from reduced intermediate steps. End-users receive trusted, high-performance substrates.

The material’s reduced thermal development matches silicon chips. Anxieties from temperature cycles are reduced. Bonding layers remain intact. Delamination threats decrease. Mechanical toughness withstands splitting during assembly. Surface area level of smoothness allows precise circuit printing. Slim metallization layers stick well. Electric connections continue to be secure.

High-temperature resistance encompasses aerospace applications. Avionics and onboard power systems deal with severe warm. AIN porcelains make certain stable operation. Rough atmospheres do not jeopardize functionality. Long-term reliability fulfills aerospace standards.

These ceramic sheets also offer in laser diode product packaging. Thermal management extends diode life. Result consistency improves. Medical lasers and commercial reducing systems benefit. Power efficiency supports lasting production. Power loss decreases align with eco-friendly power goals.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.(nanotrun@yahoo.com)

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264

What is Aluminum Nitride (AIN) ceramic? Aluminum Nitride (AIN) ceramic is a synthetic material made from aluminum and nitrogen. It handles high temperatures well. It works for electronic parts needing strong thermal conductivity. This ceramic resists heat better than many metals or plastics. It is ideal for environments where heat buildup is a problem.

Why choose AIN ceramic sheets for IGBT TO264 modules? IGBT modules generate significant heat during operation. AIN ceramic sheets move heat away from sensitive parts efficiently. This prevents overheating and extends device life. The material’s low thermal expansion matches materials like silicon. This reduces stress during temperature changes. It ensures stable performance in power electronics.

What maximum temperature can AIN ceramic substrates handle? AIN ceramic sheets withstand temperatures up to 800°C continuously. Short-term exposure can go higher without damage. They stay stable under extreme heat. This makes them suitable for high-power applications like industrial motors or electric vehicles. They do not crack or warp easily compared to other ceramics.

How do AIN ceramic sheets compare to alumina or aluminum substrates? AIN conducts heat nearly ten times better than alumina. It outperforms aluminum in high-temperature stability. Aluminum oxidizes or deforms under intense heat. AIN maintains shape and function. It is lighter than many metals. This benefits compact electronic designs where space and weight matter.

Can AIN ceramic sheets be customized for specific sizes? Yes. Factory-direct production allows custom sizing and thickness. Standard sizes are available for immediate purchase. Custom orders take minimal time. Precise cutting ensures compatibility with IGBT TO264 and similar modules. Bulk orders reduce costs for large projects. Specifications like surface finish or metallization layers can also be adjusted.

(Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264)