Overview of aluminum nitride ceramics

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of aluminum nitride ceramics

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264)

Specifications of Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264

Factory Direct High Temperature Resistance AlN Ceramic Sheets are designed for demanding applications like IGBT TO264 modules. These sheets use aluminum nitride (AlN) ceramic material known for superior thermal performance. The product offers high thermal conductivity, reaching 170-180 W/m·K. This ensures efficient heat transfer in high-power electronic systems. The sheets handle extreme temperatures up to 1000°C in inert environments. They maintain stability at 800°C in oxygen-rich settings. This makes them ideal for environments with rapid temperature changes.

The AlN ceramic substrate provides excellent electrical insulation. It has a dielectric strength over 15 kV/mm. This prevents current leakage in high-voltage devices. The material also resists chemical corrosion. It performs well in acidic or alkaline conditions. The sheets come in multiple thicknesses from 0.3 mm to 3.0 mm. Standard sizes include 50×50 mm, 100×100 mm, and custom options. Surface roughness is controlled under 0.4 µm. This ensures smooth bonding with semiconductor layers or metalized coatings.

Mechanical strength is a key feature. The AlN ceramic sheets have a flexural strength of 300-400 MPa. This prevents cracking under mechanical stress. The low thermal expansion coefficient (4.5×10⁻⁶/°C) matches common semiconductor materials. This reduces thermal stress during operation.

These substrates are optimized for IGBT modules. They improve heat dissipation in TO264 packaging. This extends component lifespan and reliability. The sheets also suit power electronics, LED modules, and automotive systems. Customizable metallization layers (copper, aluminum) are available. These enhance solderability and circuit integration.

Factory direct pricing ensures cost savings. Bulk orders come with tighter tolerances and shorter lead times. Quality certifications include ISO 9001 and RoHS compliance. Each batch undergoes rigorous thermal cycling and electrical testing.

Applications include high-frequency devices, laser diodes, and aerospace systems. The material’s purity (over 99.5% AlN content) minimizes thermal resistance. This is critical for high-performance cooling solutions.

(Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264)

Applications of Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264

Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate is designed for use in IGBT TO264 packages. These ceramic sheets handle extreme heat and electrical stress in high-power applications. The material offers excellent thermal conductivity. It transfers heat away from sensitive components quickly. This prevents overheating and improves device reliability. Aluminum nitride ceramic substrates work better than traditional materials like alumina or aluminum oxide. Alumina has lower thermal conductivity. Aluminum nitride conducts heat over 10 times faster. This makes it ideal for demanding environments.

The ceramic sheets provide strong electrical insulation. They stop current leakage even under high voltage. This protects circuits from shorting. The material also matches silicon in thermal expansion. This reduces stress between layers during temperature changes. Cracking or delamination risks drop. The sheets suit IGBT modules in electric vehicles, solar inverters, and industrial motor drives. These applications need stable performance under repeated thermal cycles.

Manufacturers use AIN substrates for their mechanical durability. The sheets resist wear and chemical corrosion. They stay stable in harsh conditions. Processing methods include precision machining. This allows custom shapes and sizes for specific module designs. Metallization layers can be added. These layers bond with copper or aluminum traces. This creates reliable electrical connections.

The ceramic sheets improve heat management in compact power electronics. High heat dissipation lets devices run at higher power without failure. System efficiency increases. Lifespan extends. Costs from cooling systems or frequent replacements decrease. Customizable thickness and surface finishes adapt to different IGBT layouts. This flexibility supports innovation in power semiconductor design.

Factory Direct AIN ceramic substrates meet strict industry standards. They perform consistently in temperatures exceeding 600°C. Thermal shock resistance ensures reliability during rapid heating or cooling. These properties make the material critical for next-gen energy systems. Electric vehicle manufacturers rely on it for battery management and traction inverters. Renewable energy installations use it in converters and grid storage. Industrial equipment applies it to high-frequency power supplies.

The product is available in various grades. Options include pure aluminum nitride or composite formulations. Technical support helps customers select the right specifications. Bulk orders reduce costs for large-scale production. Samples can be tested for compatibility before full deployment.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.(nanotrun@yahoo.com)

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264

What is this AlN ceramic sheet? It is a factory-made aluminum nitride ceramic substrate designed for high-temperature applications. The material offers excellent thermal conductivity and electrical insulation. It serves as a reliable component in electronic devices requiring heat management.

Why choose this product for IGBT TO264? The AlN ceramic sheet efficiently transfers heat away from sensitive parts in IGBT modules. High thermal conductivity prevents overheating. It ensures stable performance in power electronics. The material’s durability suits demanding industrial environments.

What temperature can it withstand? The ceramic sheet resists temperatures from 800°C to 1000°C. It maintains structural integrity under extreme heat. This makes it ideal for applications like automotive electronics or high-power LED systems. The material does not degrade quickly compared to standard alumina ceramics.

Are custom sizes available? Standard sizes include 50mm x 50mm, 100mm x 100mm, and thicknesses from 0.5mm to 3mm. Custom dimensions are possible. The factory can adjust specs to fit specific device requirements. Precision cutting ensures compatibility with IGBT TO264 layouts.

How should I handle and store the sheets? Avoid exposing the material to moisture before use. Store in a dry environment. Handle with care to prevent cracks or chips. Clean surfaces before installation to ensure proper adhesion. Use gloves to avoid contamination from oils or dust.

(Factory Direct High Temperature Resistance AIN Ceramic Sheet Aluminum Nitride/AlN Ceramic Substrate for IGBT TO264)