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Overview of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate
Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.
Features of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate
High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.
Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.
Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.
High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.
Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.
Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.
High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate)
Specifications of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate
This ceramic product takes on warmth problems in electronics. Light weight aluminum nitride moves warmth away quickly. Its thermal conductivity strikes 170 to 200 watts per meter Kelvin. This beats several other ceramics. Heat spreads quickly throughout the board. Hot spots reduce. Elements run cooler and last much longer.
The product is a superb electric insulator. High voltage will not leak via it. Circuit designs stay risk-free. This insulation works even at high temperatures. It manages continual procedure approximately 1000 levels Celsius. Thermal shocks do not split it easily. Temperature level swings are less destructive.
Its thermal expansion rate matches silicon chips very closely. This resemblance issues. Boards and chips warm up with each other. They increase at almost the very same speed. Anxiety on solder joints drops. Connections remain trustworthy. Failings from thermal biking decline.
The surface is very flat and smooth. We attain a great surface area finish. Thick movie printing requires this. Resistors, conductors, and other layers publish cleanly. Precise patterns develop. Electric performance is stable. Component positioning is exact.
Board thickness arrays are adaptable. Standard thicknesses prevail. We offer personalized dimensions too. Applications determine the most effective thickness. Thicker boards deal with even more power in some cases. Thinner boards fit tight areas. We can meet specific needs.

(Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate)
Applications of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate
Aluminum Nitride ceramic substratums manage warmth incredibly well. They move heat far from warm digital parts fast. This quits components from getting also hot and stopping working. These substrates also obstruct electrical power completely. They keep high-power circuits secure. This combination is essential for numerous requiring electronic devices.
LED lighting systems generate intense heat. Light weight aluminum Nitride substrates spread this heat successfully. They allow LEDs run brighter and last much longer. Power electronics in cars and trucks and industry need reliable components. High voltage modules utilize these substrates. They take care of the warm from effective transistors and diodes. This stops getting too hot and break downs. The product remains secure under tough conditions.
RF and microwave devices call for accurate performance. Aluminum Nitride supplies superb electric insulation at high frequencies. It keeps signals clean. The product doesn’t broaden much when hot. It matches well with various other electronic products. This prevents splits and connection troubles throughout temperature level adjustments. Security is important for radar and communication equipment.
The ceramic surface area is very smooth and strong. Manufacturers publish thick layers of metal circuits directly onto it. This produces solid electric courses for high currents. The bonds in between the metal and ceramic are strong and reputable. This process is effective for making intricate motherboard. These boards master high-power, high-frequency scenarios needing superior warm control. They are located in sophisticated power materials and amplifiers.
Company Introduction
Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.
Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

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T/T, Western Union, Paypal, Credit Card etc.
Shipment Methods
By air, by sea, by express, as customers request.

5 FAQs of Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate
Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate: 5 Key Questions
What is this Aluminum Nitride substrate?
This stuff is a special ceramic base. It’s made mainly from aluminum nitride powder. Factories shape it then bake it at very high temperatures. It becomes a super flat, super hard plate. Electronics companies put thick layers of metal paste on top. They print circuits directly onto it. This base holds powerful chips.
Why pick Aluminum Nitride over other materials?
Aluminum Nitride beats older ceramics like alumina. Its big trick is moving heat incredibly fast. Think ten times faster than alumina. Modern electronics create huge heat. AlN pulls that heat away from delicate chips. This stops things from getting too hot. It keeps performance high. It stops failures. This is the main reason people use it.
How does the thick printing help?
Thick printing means putting down a lot of metal paste. Think screen printing like a t-shirt. You get much thicker metal lines. Thicker lines carry way more electrical current. They handle high power better. They also spread heat out more effectively across the whole board. It’s vital for big power devices needing strong connections.
Where do you actually use these substrates?
You find these inside tough electronics needing serious cooling. Power modules for electric cars and trains use them. Base stations for phone networks use them. High-power LED lighting systems use them. RF amplifiers and military gear use them. Any place where chips get super hot and must keep working uses them.
Is Aluminum Nitride hard to work with?
Yes, it can be trickier than older ceramics. Aluminum Nitride itself is very hard. Machining it precisely costs more. Getting the thick metal paste to stick perfectly needs careful control. The whole process demands exact temperatures and methods. This means the final product costs more. But the performance boost is worth it for demanding jobs.

(Heat Dissipation Thick Printing Ceramic Aluminum Nitride Substrate)
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