Overview of High Temperature Ultra-Thin Thermal Conductivity Aln Aluminum Nitride Ceramic Wafer

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of High Temperature Ultra-Thin Thermal Conductivity Aln Aluminum Nitride Ceramic Wafer

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(High Temperature Ultra-Thin Thermal Conductivity Aln Aluminum Nitride Ceramic Wafer)

Specifications of High Temperature Ultra-Thin Thermal Conductivity Aln Aluminum Nitride Ceramic Wafer

Here’s the product content about High Temperature Ultra-Thin Thermal Conductivity AlN Aluminum Nitride Ceramic Wafer:

This High Temperature Ultra-Thin Aluminum Nitride (AlN) Ceramic Wafer handles extreme heat well. It moves heat away from critical parts very fast. Its thermal conductivity reaches 170 to 180 W/mK. This performance beats many other ceramics easily.

The wafer is incredibly thin. Thickness options run from just 0.1mm up to 0.6mm. This thinness saves space in tight designs. It also allows some flexibility where needed. Don’t worry about it breaking easily. It stays strong and flat under high heat stress. It reliably works at temperatures up to 850°C.

Aluminum Nitride doesn’t conduct electricity. It’s a top-notch electrical insulator. This prevents shorts in your circuits. Its CTE matches silicon chips well. This reduces stress during heating and cooling cycles. It keeps connections reliable over time.

The surface finish is excellent. It’s smooth and flat for precise bonding. You get consistent performance across the whole wafer. It bonds securely to metals and other materials. This ensures solid thermal paths.

This AlN wafer is perfect for demanding jobs. Use it in high-power electronics needing serious heat control. It fits well in semiconductor tools. It’s great for high-brightness LED modules. Power modules and RF packages benefit too. Any application needing thin, tough, super heat-spreading material should consider it.

(High Temperature Ultra-Thin Thermal Conductivity Aln Aluminum Nitride Ceramic Wafer)

Applications of High Temperature Ultra-Thin Thermal Conductivity Aln Aluminum Nitride Ceramic Wafer

This thin ceramic plate handles extreme heat well. It moves heat fast while stopping electricity leaking. This makes it perfect for tough electronics jobs. Many industries use it now. Power electronics need materials that survive high heat and power. This AlN wafer takes heat away from power chips. It keeps things running cooler and safer. Electric cars and trains use these wafers for their power systems. They help manage the intense heat in batteries and motor controllers. LED lights get very hot. This wafer moves heat off the LED chip fast. That keeps the light bright and lasting longer. Big lighting displays and street lamps rely on it. Making computer chips needs high temperatures. This wafer holds silicon wafers steady during this process. It doesn’t warp or contaminate the chips. Lasers generate a lot of heat. This wafer cools laser diodes effectively. It ensures stable laser performance in cutting and medical tools. Radio frequency devices heat up during use. This wafer cools RF chips and modules. It is vital for strong signal power in communication gear. High heat sensors need reliable bases. This AlN wafer provides a stable, insulating platform. Sensors in engines and turbines use it. Its thinness allows for smaller, more efficient electronic packages. It saves space and weight. It bonds well to metals like copper. This creates strong heat paths out of devices. It resists chemical damage too. This wafer handles tough factory conditions. It works reliably for a long time.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of High Temperature Ultra-Thin Thermal Conductivity Aln Aluminum Nitride Ceramic Wafer

People often ask what AlN ceramic wafers are. They are thin plates made from aluminum nitride. This material handles heat extremely well. It moves heat away from hot spots very effectively. These wafers are used where managing high temperatures is critical.

Many wonder why AlN is better than other ceramics like alumina. AlN moves heat much faster. Alumina moves heat about 30 W/mK. AlN moves heat around 170-200 W/mK. This high thermal conductivity is the main advantage. It keeps electronics cooler. It prevents overheating failures.

A common question is how thin these wafers can be. Manufacturers produce them very thin. Thicknesses start under 0.5mm. They can go down to 0.1mm or even less. This thinness is vital for modern, compact devices. It saves space. It allows heat to escape easily from tight areas.

People ask about the temperature limits. AlN wafers withstand very high heat. They operate reliably above 1000°C. Some grades handle over 1800°C short term. This makes them perfect for harsh environments. They are stable under thermal stress. They do not break down easily.

Users want to know where these wafers are used. They are essential in power electronics. Think electric vehicles and high-power LEDs. They are key in advanced semiconductor packaging. They serve in aerospace and defense systems. Any place needing thin, strong, super heat-spreading parts uses them. They solve critical cooling problems.

(High Temperature Ultra-Thin Thermal Conductivity Aln Aluminum Nitride Ceramic Wafer)