Overview of High Thermal Conductivity Aluminum Nitride Ceramic Plate for Semiconductor Industry

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of High Thermal Conductivity Aluminum Nitride Ceramic Plate for Semiconductor Industry

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(High Thermal Conductivity Aluminum Nitride Ceramic Plate for Semiconductor Industry)

Specifications of High Thermal Conductivity Aluminum Nitride Ceramic Plate for Semiconductor Industry

Semiconductor gadgets generate substantial warm throughout operation. Effective warmth monitoring is vital for efficiency and reliability. Aluminum nitride ceramic plates fix this problem well. These plates relocate heat away from delicate elements extremely efficiently. Light weight aluminum nitride provides extraordinary thermal conductivity. Common worths range from 170 to 200 W/mK. This efficiency defeats several other ceramics significantly. Warm transfers rapidly via home plate material. Elements stay cooler. Devices function far better and last much longer.

Thermal development matching is another major advantage. Aluminum nitride broadens and contracts at a rate really close to silicon. This similarity is very important. Silicon is the base product for many semiconductor chips. Home plate and the chip increase together throughout home heating cycles. Stress at the link points is reduced. Fracturing or delamination risks are greatly minimized. Solid, trustworthy bonds are kept.

Electrical insulation is essential in these applications. Aluminum nitride supplies superb dielectric properties. It stops power from moving where it should not. This stops short circuits. High voltage malfunction strength makes certain safety and security and feature. The material holds up against high voltages without failing.

Mechanical stamina is likewise excellent. Light weight aluminum nitride plates are tough and rigid. They withstand wear and contortion. They take care of the physical needs of semiconductor handling and assembly. Surface high quality is normally extremely high. Plates are smooth and flat. This makes certain great call for heat transfer. Accurate measurements are common. Plates fit accurately right into settings up.

These plates operate in demanding thermal management duties. They are common in high-power LED product packaging. They cool laser diodes properly. They are vital substratums for power components. They offer in RF/microwave bundles. The semiconductor industry counts on their distinct mix of buildings.

(High Thermal Conductivity Aluminum Nitride Ceramic Plate for Semiconductor Industry)

Applications of High Thermal Conductivity Aluminum Nitride Ceramic Plate for Semiconductor Industry

Semiconductor tools create considerable warmth during procedure. This heat has to move away promptly. Aluminum nitride ceramic plates stand out right here. Their high thermal conductivity relocations heat very successfully. This quits getting too hot problems. Overheating damages delicate electronic devices. It also minimizes performance. Light weight aluminum nitride fixes this.

These plates take care of warm in power modules. Power components manage high currents. They get incredibly warm. Aluminum nitride substratums carry the warmth to cooling down systems. This maintains temperatures steady. Steady temperatures suggest reliable operation. Devices last much longer. Failings decrease.

Laser diodes likewise require effective cooling. They create intense light and warmth. Light weight aluminum nitride plates form the base. They spread out the warmth rapidly. This avoids the laser diode from getting as well hot. Regular temperature makes sure specific light output. Performance stays high.

Wafer processing utilizes high temperatures. Tools like electrostatic chucks holds silicon wafers. Light weight aluminum nitride plates job well in these chucks. They warmth or amazing wafers evenly. Consistent temperature level is important for precise etching and deposition. Process returns improve. Excellent harmony suggests fewer malfunctioning chips.

Light weight aluminum nitride stands up to electricity well. It doesn’t conduct power. This electric insulation is vital. It prevents short circuits. Elements remain secure. The product is also extremely difficult. It holds up against physical wear. It takes care of extreme chemicals used in chip production. This strength makes sure long life popular manufacturing facility setups.

The material broadens very little when heated. Its thermal growth very closely matches silicon. This matching is essential. It protects against stress and anxiety when materials heat up with each other. Anxiety cracks elements. Preventing cracks implies more reputable tools. Bonding layers remain undamaged. This is essential for power devices and sensors.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

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5 FAQs of High Thermal Conductivity Aluminum Nitride Ceramic Plate for Semiconductor Industry

Aluminum nitride ceramic plates matter a lot for semiconductors. Here are five common questions answered.

What makes aluminum nitride special? Aluminum nitride moves heat very well. Think 170-200 W/mK. This is much better than alumina. It also stops electricity. This combination is key for electronics.

Why use it in semiconductors? Semiconductors generate heat. Too much heat hurts performance and life. Aluminum nitride pulls this heat away fast. It keeps semiconductors cool. It also expands and shrinks like silicon chips. This avoids stress cracks.

How does it beat alumina? Alumina is common. Alumina moves heat around 25 W/mK. Aluminum nitride moves heat much faster. This is vital for powerful devices. Aluminum nitride handles more heat.

Is surface finish important? Yes. A very smooth plate surface is critical. It touches the hot semiconductor device. Good contact moves heat best. Rough surfaces trap air. Air is a bad heat conductor. Smooth surfaces work better.

Any handling tips? Handle these plates carefully. They are strong but brittle. Avoid dropping them. Avoid sharp impacts. Chips or cracks ruin the plate. Protect the edges. Use proper tools during installation.

(High Thermal Conductivity Aluminum Nitride Ceramic Plate for Semiconductor Industry)