Overview of High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink)

Specifications of High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

This aluminum nitride ceramic wafer manages warmth incredibly well. It relocates warmth quick. You require that for top-performing heat sinks. The thermal conductivity reaches 170-180 W/mK. That’s much better than routine aluminum oxide porcelains. Warmth transfers effectively away from hot elements.

Electric insulation matters also. This wafer obstructs electrical energy completely. It withstands high voltages. You can use it safely popular electronic devices. It keeps the heat moving without electric threats.

The product matches silicon and gallium arsenide chips very closely. Their thermal expansion prices are similar. This matching is essential. It quits tension splits throughout temperature changes. Your settings up remain reliable over several heating and cooling down cycles.

Strength and sturdiness are integrated. This wafer stands up to wear and rust. It manages harsh chemicals and high temperatures without breaking down. It’s a tough material for resilient efficiency.

Surface area quality is excellent. The wafer is really flat and smooth. This makes sure limited call with heat-generating parts. Excellent get in touch with means better warmth drain of the tool. Air gaps are lessened.

The wafer works flawlessly in power electronic devices. Assume LED illumination, RF modules, laser diodes, and high-power semiconductor devices. It draws warm away from sensitive components quick. This prevents getting too hot and failure.

It likewise fits well in aerospace and vehicle systems. These atmospheres fume and press elements hard. The material’s security under thermal cycling is vital right here. Efficiency stays consistent.

You get a high-performance thermal solution. It combines superior warm spreading, electrical seclusion, and integrity. It fixes warm issues in portable, high-power styles effectively.

(High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink)

Applications of High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

Digital gadgets produce warm throughout procedure. This heat has to vanish successfully. Warmth sinks assistance move heat from warm parts like integrated circuit. They prevent overheating and damages. Heat sinks require good thermal conductivity. Light weight aluminum nitride ceramic wafers use outstanding thermal conductivity. This building is vital for top warm sink efficiency.

Aluminum nitride ceramic wafers relocate warmth away really quick. Their thermal conductivity is much greater than normal aluminum oxide ceramics. It approaches the level of some metals. Light weight aluminum nitride functions well for relocating heat. This makes it best for requiring cooling jobs. Warm sinks using these wafers handle extreme warmth loads conveniently.

These ceramic wafers give strong electric insulation also. They quit electrical energy from flowing where it should not. This electric isolation is important. It allows putting heat sinks directly on electronic circuits. There’s no threat of short circuits. This close call boosts warmth transfer effectiveness substantially. Tools run cooler and more accurately.

High thermal conductivity light weight aluminum nitride ceramic wafers are made use of in many locations. Power electronics like IGBTs and MOSFETs require them. These parts get very warm during switching. LED illumination systems utilize them for far better thermal management. They aid LEDs last much longer. RF and microwave tools profit considerably. Telecommunications equipment counts on secure temperatures. Advanced computing and information facilities utilize these wafers as well. They cool powerful processors effectively. Electric cars use them in power control units and battery systems. Excellent thermal management is vital there.

These wafers are likewise chemically stable. They resist rust well. They do not react easily with other materials. This ensures long-term integrity in severe settings. Their mechanical toughness is great. They handle physical stress and anxiety fairly. Designers can make thinner heat sinks. This conserves area in compact devices. Utilizing light weight aluminum nitride ceramic wafers fixes tough warm issues. They enhance efficiency and life-span in vital electronic devices.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

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5 FAQs of High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink

What makes Aluminum Nitride good for heat sinks?
Aluminum Nitride ceramic wafers move heat extremely well. This high thermal conductivity is key. Heat sinks need to pull heat away fast. Aluminum Nitride does this job effectively.

Is Aluminum Nitride better than other ceramics for heat?
Yes, usually it is. Aluminum Nitride conducts heat much better than alumina. It is close to some metals. This makes it a top choice where heat must move quickly out of tight spaces.

Does Aluminum Nitride conduct electricity?
No, it does not. Aluminum Nitride is an excellent electrical insulator. This is important. Heat sinks often touch electronic parts. Good electrical insulation prevents short circuits. Heat moves out safely.

Can Aluminum Nitride handle high temperatures?
Yes, it handles high heat very well. Aluminum Nitride stays strong and stable at temperatures electronics create. It does not break down easily. This reliability matters for long-lasting performance.

Why use Aluminum Nitride wafers in electronics?
Electronics get hot, especially powerful chips. Space is limited. Aluminum Nitride wafers fit thin designs. They move heat fast from the hot spot. They insulate electrically. Their thermal expansion matches silicon chips well. This reduces stress. Electronics run cooler and last longer.

(High Thermal Conductivity Aluminum Nitride Ceramic Wafer for Heat Sink)