Overview of High Thermal Conductivity Aluminum Nitride Plate for Electronic Substrates

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of High Thermal Conductivity Aluminum Nitride Plate for Electronic Substrates

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(High Thermal Conductivity Aluminum Nitride Plate for Electronic Substrates)

Specifications of High Thermal Conductivity Aluminum Nitride Plate for Electronic Substrates

This light weight aluminum nitride plate manages warm incredibly well. It’s designed as a reliable base for requiring digital components. Electronic devices produce warm. Excessive heat hurts performance and shortens gadget life. This product moves warmth away fast. That maintains sensitive elements cooler and running much better.

Warm transfer is its primary task. The thermal conductivity score is high. It’s typically above 170 W/mK. This number defeats normal light weight aluminum oxide porcelains significantly. Warm spurts rapidly. Your power modules or LED chips remain within secure temperature ranges. This stability is critical for modern electronic devices pushing power limitations.

Electrical insulation is essential as well. This plate blocks power effectively. It prevents hazardous shorts in between circuits. The dielectric stamina is solid. High voltages will not quickly break through. You obtain safe procedure also in limited, high-power arrangements. The product itself is really steady chemically. It will not deteriorate easily from common processes or settings.

Accuracy matters for substrates. This plate is made level and smooth. Limited density control makes certain consistent performance. The surface finish is fine. This enables exact circuit printing or element bonding. It’s created utilizing a controlled pushing technique. This makes certain consistent density and residential properties throughout the entire plate. No weak points or variants.

The material doesn’t increase much with heat. Its warm expansion rate suits silicon chips very closely. This matching is important. When points warm up throughout use, the chip and substratum broaden at nearly the exact same rate. This lowers tension on solder joints and links. Reliability enhances. Fewer failings happen gradually.

It deals with heats well. You can utilize it in warm settings or during high-temperature setting up steps. It stands up to wear and chemical assault. Long-lasting efficiency stays regular. This light weight aluminum nitride supplies a practical remedy for thermal monitoring obstacles. It directly sustains developing extra effective, portable, and trusted electronics requiring premium warmth dissipation.

(High Thermal Conductivity Aluminum Nitride Plate for Electronic Substrates)

Applications of High Thermal Conductivity Aluminum Nitride Plate for Electronic Substrates

High thermal conductivity aluminum nitride layers address huge heat troubles in electronics. These plates deal with warm exceptionally well. They move heat far from sensitive components quickly. This maintains devices cooler. Cooler gadgets last much longer. They additionally work much better.

Aluminum nitride plates are special. They conduct warm almost like metal. However they do not carry out electrical power. This electrical insulation is essential. It prevents brief circuits. Alumina ceramic is common. However aluminum nitride moves warmth over 6 times much faster. This big difference issues for powerful electronics.

Think of brilliant LED lights. They create a lot of warmth in a little area. Aluminum nitride substratums draw that warm out rapidly. This quits the LEDs from overheating. Overheating makes LEDs dim much faster. Good warm management maintains them bright and reliable for several years.

Power electronics also require these plates. Gadgets like IGBTs and power components regulate big currents. Big currents create extreme warm. Light weight aluminum nitride substrates attract this warmth into the air conditioning system efficiently. This prevents the power chips from falling short. It permits smaller, more effective layouts.

High-frequency RF gadgets profit also. Signals in RF circuits are sensitive. Warm can misshape these signals. Light weight aluminum nitride keeps the circuit temperature secure. Secure temperature indicates constant signal efficiency. This is crucial for communication and radar systems.

Laser diodes are another key use. They pack massive power into small chips. Without outstanding warm removal, they wear out quick. Light weight aluminum nitride plates provide the necessary thermal path. This makes sure secure laser output and long service life.

These plates are tough. They deal with thermal shocks well. They stand up to chemical corrosion. Their thermal growth carefully matches crucial semiconductors like silicon. This matching reduces tension throughout heating and cooling down cycles. It makes assemblies extra dependable. Light weight aluminum nitride sets you back greater than alumina. However its performance justifies the cost popular applications. Engineers choose it for crucial warmth administration jobs.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

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5 FAQs of High Thermal Conductivity Aluminum Nitride Plate for Electronic Substrates

What makes aluminum nitride plates good for cooling electronics?
Aluminum nitride moves heat very fast. It keeps circuits cool. This prevents overheating. Electronics last longer. Aluminum nitride cools better than most materials.

Does aluminum nitride conduct electricity?
No. Aluminum nitride blocks electricity. This is important. Circuits stay safe. No short circuits happen. It works as an electrical barrier.

Are aluminum nitride plates strong?
Yes. They handle heat changes well. They don’t crack easily. This is good for devices getting hot then cold. Aluminum nitride resists thermal shock.

Can you attach metal layers to aluminum nitride plates?
Yes. The surface bonds well with metals. Copper or gold layers stick properly. This creates good circuit boards. The bond stays strong.

Is aluminum nitride difficult to machine?
It is harder than some materials. Special tools cut it. Diamond tools work best. You can polish it smoothly. Handle it carefully. It avoids breaking.

(High Thermal Conductivity Aluminum Nitride Plate for Electronic Substrates)