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Overview of Large Particle Aluminum Nitride Filler Powder 30um for Thermal Interface Materials
Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.
Features of Large Particle Aluminum Nitride Filler Powder 30um for Thermal Interface Materials
High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.
Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.
Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.
High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.
Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.
Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.
High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(Large Particle Aluminum Nitride Filler Powder 30um for Thermal Interface Materials)
Specifications of Large Particle Aluminum Nitride Filler Powder 30um for Thermal Interface Materials
Below’s the product details for Huge Bit Light Weight Aluminum Nitride Filler Powder 30um. This powder is for thermal interface materials. It moves heat effectively. Pure light weight aluminum nitride relocates warm far better than several various other ceramics. This certain powder has big fragments. The ordinary dimension is 30 micrometers. Large bits assist warmth flow better in some materials.
High purity issues. Pure aluminum nitride relocates heat well. This powder is extremely pure. It is over 99% light weight aluminum nitride. Reduced oxygen is also essential. Oxygen makes warmth move slower. This powder has little oxygen. Oxygen content is under 1%. This maintains the warmth moving fast. Anticipate thermal conductivity around 170 to 200 W/mK. This is for the powder itself.
Its shape is primarily rounded. Round bits are good. They mix into pastes or pads easily. Round bits let you load a lot more filler into the product. Much more filler generally implies far better heat flow. The powder is dense. Its tap thickness is high. This helps make final products thick also. The powder flows well. Great circulation aids throughout processing. It makes manufacturing smoother.
Thermal paste manufacturers choose this powder. Pad makers utilize it also. It enhances the warm transfer in their items. Electronics need good heat control. This powder aids with that. It resolves heat issues in difficult situations. Assume computer chips and power modules. Keep the powder completely dry. Store it sealed. Wetness harms performance. This powder is a leading choice for demanding thermal materials. It supplies solid performance.

(Large Particle Aluminum Nitride Filler Powder 30um for Thermal Interface Materials)
Applications of Large Particle Aluminum Nitride Filler Powder 30um for Thermal Interface Materials
Large fragment light weight aluminum nitride filler powder around 30 micrometers is very important for thermal interface materials. Electronics produce heat. This warmth has to move away rapidly. Or else, tools overheat and fall short. Thermal user interface materials, or TIMs, bridge voids between warm parts and coolers like heatsinks. Voids trap air. Air is a poor heat conductor. TIMs replace the air. They allow warmth flow better.
This details light weight aluminum nitride powder is extremely useful. Its large 30um fragment dimension helps create reliable warmth courses via the TIM. Bigger bits can touch each various other even more easily inside the product. This forms bridges for warm to travel across. Light weight aluminum nitride itself is outstanding at conducting warmth. It also quits power from moving. This electric insulation is essential. It protects against short circuits in digital tools.
Makers add this powder to various TIM kinds. They mix it right into thermal greases and pastes. These soft products fill up tiny blemishes on surface areas. The powder makes these oils perform warmth far better. They also blend it right into thermal pads. Pads are pre-formed sheets. They are very easy to deal with and mount. The aluminum nitride powder increases the pad’s heat transfer capability. Another usage remains in stage adjustment materials. These products thaw a little when warm. They stream right into voids after that solidify. The powder boosts their thermal efficiency too.
The powder enhances how well TIMs function. It directly raises thermal conductivity. This implies warm steps quicker from the hot element to the colder. Reduced operating temperature levels result. Devices run cooler and more accurately. Their lifespan frequently increases. The electric insulation residential or commercial property keeps everything secure. Large bit powder similar to this is usually selected. It provides excellent warmth flow without making the TIM too thick or hard to use. It’s commonly used in demanding electronic devices. Computer systems, power supplies, LED lighting, and vehicle electronics all benefit. Reliable warm management is vital. This aluminum nitride filler powder plays a crucial role.
Company Introduction
Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.
Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

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By air, by sea, by express, as customers request.

5 FAQs of Large Particle Aluminum Nitride Filler Powder 30um for Thermal Interface Materials
What is large particle aluminum nitride filler powder?
This is a ceramic powder with big particles. People use it to make thermal interface materials better. It helps heat move away from electronics. The big particles are 30 micrometers across.
Why use large 30um particles?
Bigger particles improve heat flow in thermal pastes and pads. Small particles pack tightly but trap heat. Large particles create better paths for heat to travel. 30um is a good size for this. It balances heat flow and how the material spreads.
How does it make thermal materials conduct heat better?
Aluminum nitride itself moves heat very well. Adding these large particles creates more direct routes for heat inside the paste or pad. Heat travels through the powder particles faster than through the polymer base. More large particles mean more heat paths.
Does it work with different thermal materials?
Yes, it works with many common types. These include silicone greases, epoxy resins, and gap filler pads. The powder mixes into the base material easily. It keeps the thermal interface material stable and effective.
Does it change how thick the material is?
It can make thermal paste thicker. Smaller particles make paste flow smoother. Large particles add more resistance to flow. This needs consideration for application methods. But the improved heat transfer is usually worth it. Users adjust the mix for the right balance.

(Large Particle Aluminum Nitride Filler Powder 30um for Thermal Interface Materials)
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