Overview of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic)

Specifications of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

This metallized light weight aluminum nitride ceramic substrate uses Amb Innovation and OSP surface area treatment. It’s built for challenging electronics requiring top warm management. Amb Innovation bonds copper directly onto the aluminum nitride base. This develops an unbelievably solid link. The bond deals with heats well. It additionally relocates heat away from warm components very efficiently. Aluminum nitride itself lugs warm far better than other porcelains. This maintains sensitive electronic devices cooler.

The surface area obtains an OSP surface. OSP implies Organic Solderability Chemical. This slim coating secures the subjected copper traces. It quits oxidation before you solder components on. OSP keeps the surface area ready for soldering. You get reliable solder joints without additional actions. The copper layer is thick. It deals with high electrical currents. This is very important for power devices. The ceramic base offers excellent electrical insulation. It protects against unsafe shorts. The product is literally strong. It stands up to cracking under anxiety. Substrates are available in common sizes. Density is precise for regular setting up. Custom sizes and shapes are possible as well.

This substratum masters demanding power electronic devices. Believe electrical vehicle components, commercial motor drives, and high-power LED systems. It additionally works well in RF and microwave circuits. The mix moves heat quick. It likewise gives solid electrical seclusion. The OSP finish guarantees very easy, reliable soldering. This product solves warm issues in small, high-power designs. It increases tool performance and life-span. Designers pick it for essential thermal management work.

(Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic)

Applications of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

Metallized aluminum nitride substrates with AMB innovation and OSP treatment resolve hard issues popular electronics. AMB bonds metal layers extremely strongly to the light weight aluminum nitride ceramic. This creates an extremely reputable connection. The bond makes it through large temperature level swings consistently. OSP finish safeguards the subjected metal surfaces. This finish stops oxidation and rust. It maintains the metal surface areas prepared for soldering gradually. This mix provides a top-tier ceramic circuit card material.

These substrates take care of huge quantities of warm. Aluminum nitride itself moves warm away super fast. The strong AMB bond moves heat efficiently right into the metal layers. Components stay much cooler. This stops overheating failings. It lets gadgets go for higher power safely. The electrical insulation remains solid also at high voltages. This is important for safety and efficiency.

Power electronic devices require this sturdiness. Assume electrical automobile components, industrial electric motor drives, and solar power inverters. These devices produce intense heat. They require outright reliability. Metallized AlN with AMB and OSP gives it. The substratum lasts longer. It reduces costly breakdowns.

High-frequency electronic devices additionally benefit. Applications include 5G/6G telecom base stations and advanced radar systems. Signals take a trip extremely quickly right here. Marginal signal loss is critical. The outstanding electric homes of AlN aid. The precise OSP surface area makes certain regular soldering. This keeps signal integrity.

Laser diode product packaging is one more crucial usage. High-power lasers create concentrated warm. Efficient warmth elimination is crucial. The thermal efficiency of metallized AlN maintains laser diodes stable. This secures the laser’s power and lifespan.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic

Metallized AlN Substrate with AMB Tech and OSP Treatment: Key Questions

What is AMB technology on Aluminum Nitride?
AMB means Active Metal Brazing. It bonds metal layers directly onto the Aluminum Nitride ceramic. This creates a super strong connection. The bond is reliable for tough jobs. It handles heat and electricity well.

Why pick Aluminum Nitride ceramic?
Aluminum Nitride moves heat away incredibly fast. It keeps electronic parts much cooler. This prevents overheating. Devices last longer. It also doesn’t bend or stretch much with heat changes. Parts stay put. Electricity doesn’t easily pass through it either. This is good insulation.

What does OSP treatment do?
OSP stands for Organic Solderability Preservative. It’s a thin coating on the metal parts. This coating stops rust. It keeps the metal ready for soldering. Your solder sticks perfectly every time. It’s simple and works well.

How good is the heat spreading?
The heat spreading is excellent. Aluminum Nitride itself moves heat fast. The AMB bond doesn’t slow heat down. Heat moves quickly from hot parts into the ceramic. Then the heat spreads out. This cools everything down effectively. Your devices run cooler and more stable.

Is this substrate reliable long-term?
Yes, it’s built for tough conditions. The AMB bond is very strong. It doesn’t weaken easily with heat cycling. The Aluminum Nitride base is stable. The OSP coating protects the metal. We test it hard. It handles high heat, power, and repeated use without failing. You get a durable part.

(Metallized Aln Substrate with Amb Technology and OSP Treatment Aluminum Nitride Ceramic)