Overview of Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management)

Specifications of Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management

This thin AlN ceramic plate is a light weight aluminum nitride substratum developed for managing heat in electronics. It manages heats and effectively moves warm away. The product is light weight aluminum nitride. This ceramic is solid and stands up to wear. It likewise stops electrical energy from streaming. This prevents brief circuits. Home plate is really slim. Usual thickness is 0.25 mm to 1.0 mm. You can get other sizes too. Length and size are often 10mm to 50mm. Customized forms are possible. The thermal conductivity is high. It relocates warmth quick. The worth is 170-200 W/mK. This defeats many other ceramics. The plate remains secure when warm. It doesn’t expand much. The thermal expansion matches silicon. That avoids breaking in chips. Electric insulation is superb. The dielectric strength is over 15 kV/mm. The plate obstructs existing leakage. Surface area finish is smooth. The roughness is under 0.2 microns. This assists connect elements conveniently. Home plate operates in power modules. It cools IGBTs and MOSFETs. LED illumination uses it for heat spreading. RF devices take advantage of reduced signal loss. Semiconductor plans rely upon it. Laser diodes require its cooling power. The plate manages difficult conditions. It stands up to chemical damages. It will not thaw listed below 2200 ° C. You obtain dependable performance. The material is safe and safe.

(Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management)

Applications of Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management

Slim AlN ceramic plates fix big heat troubles. Aluminum Nitride moves warmth effectively. This makes it perfect for thermal management. Electronic devices need reliable air conditioning. Thin AlN plates provide this performance.

LED illumination gets very hot. Way too much warmth damages LED chips. It makes lights dimmer much faster. Thin AlN substratums imitate a warm freeway. They draw heat far from the LED chip quick. This keeps the LED intense and long lasting much longer. Good thermal administration is vital here.

Power electronic devices create extreme heat. Assume devices like IGBTs and MOSFETs. These components are inside inverters and converters. They manage high power degrees. Warm can ruin them. Thin AlN plates install directly under these power tools. They suck the heat out swiftly. This stops dangerous overheating. It keeps the entire system secure and trustworthy.

Semiconductor devices additionally struggle with warm. High-power incorporated circuits (ICs) load great deals of energy into tiny areas. This heat needs to expand fast. Thin AlN layers job as warmth spreaders. They connect directly to the hot IC. The plate relocates warm sidewards efficiently. This stops local hot spots. It shields the sensitive semiconductor parts.

RF and microwave elements require steady temperature levels. Parts like amplifiers and transistors work at high regularities. Their efficiency changes if they get as well hot. Thin AlN substrates offer superb thermal security. They perform warm away fast. This keeps the temperature level stable. Steady temperature level suggests stable signal outcome.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

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5 FAQs of Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management

Here are 5 FAQs about Thin AlN Ceramic Plate Aluminum Nitride Substrate for Thermal Management:

Why pick aluminum nitride for thermal management?
Aluminum nitride moves heat away very well. It keeps things cool. It also stops electricity flowing through it. This is important. Many materials do one or the other. Aluminum nitride does both well. This makes it special for electronics needing cooling and insulation.

How well does aluminum nitride conduct heat?
It moves heat much better than regular alumina ceramic. Aluminum nitride conducts heat almost ten times better. It is almost as good as beryllia, but safer. Aluminum nitride is safer to handle. This high thermal conductivity is its main advantage.

Does aluminum nitride insulate electrically?
Yes, it blocks electricity very effectively. Aluminum nitride is an excellent electrical insulator. High voltage cannot pass through it easily. This protects electronic parts. Good thermal management and strong electrical insulation work together in one material.

Can aluminum nitride handle high temperatures?
Yes, it works well under heat. Aluminum nitride stays stable at very high temperatures. It does not melt or break down easily. Its strength holds up. This makes it reliable for demanding applications like power electronics and LEDs.

Can you machine aluminum nitride plates?
Yes, but it requires special methods. Aluminum nitride is a hard ceramic. Standard tools might not work. It can be precisely cut, drilled, and shaped using diamond tools or lasers. This allows custom sizes and features for specific electronic assemblies.

(Thin Aln Ceramic Plate Aluminum Nitride Substrate for Thermal Management)