Introduction to Alumina Powder Spherical Aluminum Oxide for Thermal Conductivity Filler Used in EMC Ccl

Alumina ceramics are known for their high hardness, wear resistance, corrosion resistance, good electrical insulation and high temperature stability. According to the different alumina content, it can be divided into different grades, such as 95 porcelain, 99 porcelain, etc., among which 99 porcelain refers to ceramic materials with an alumina content of 99%. As the alumina content increases, its mechanical strength and electrical insulation properties will also increase accordingly.

Characteristics of Alumina Powder Spherical Aluminum Oxide for Thermal Conductivity Filler Used in EMC Ccl

High Hardness: Alumina ceramics have extremely high hardness, which makes it very wear-resistant and suitable for manufacturing abrasive tools and parts that require wear resistance.

Wear resistance: Due to its high hardness, alumina ceramics show excellent wear resistance and are suitable for manufacturing parts for long-term use.

Corrosion resistance: Alumina ceramics have good resistance to most acids and alkalis, making them widely used in the chemical industry.

Good electrical insulation: As an excellent electrical insulating material, alumina ceramics are widely used in electronic and electrical products.

High temperature stability: Ability to withstand extremely high temperatures without significant physical or chemical changes, which makes it an ideal choice for applications in high temperature environments.

Biocompatibility: In the medical field, certain grades of alumina ceramics are used to make medical devices such as artificial joints due to their good biocompatibility.

(Alumina Powder Spherical Aluminum Oxide for Thermal Conductivity Filler Used in EMC Ccl)

Specifications of Alumina Powder Spherical Aluminum Oxide for Thermal Conductivity Filler Used in EMC Ccl

Our spherical alumina powder is made for thermal conductivity fillers. It boosts heat transfer in epoxy molding compounds and copper-clad laminates. This powder has a perfectly round shape. The shape is key. It lets particles pack tightly together. Tight packing means better thermal pathways through the material. You get higher thermal conductivity with less filler needed. This keeps viscosity low during processing. Low viscosity is good. It makes mixing and molding easier. We control particle size carefully. Fine powders are available. Coarser grades are also an option. Consistent size distribution is vital. It ensures even dispersion within the resin matrix. Uniform dispersion prevents clumping. Clumps hurt thermal performance. High purity is a must. Our alumina has very low levels of sodium and other impurities. Impurities can degrade the epoxy or affect electrical properties. You need reliable material properties. The spherical shape also improves flow. It reduces wear on equipment during production. Lower wear means longer tool life and less downtime. Surface chemistry is optimized. This gives strong bonding between the alumina particles and the epoxy resin. Strong bonding transfers heat efficiently from the chip to the heat sink. Good adhesion prevents filler settling. Settling causes uneven thermal management. Our powder maintains stable performance across a wide temperature range. It handles the heat cycles in electronic devices.

(Alumina Powder Spherical Aluminum Oxide for Thermal Conductivity Filler Used in EMC Ccl)

Applications of Alumina Powder Spherical Aluminum Oxide for Thermal Conductivity Filler Used in EMC Ccl

Spherical alumina powder is a key material for thermal management. This aluminum oxide form works as a filler. It boosts heat transfer in electronic parts. Epoxy Molding Compounds (EMC) and Copper-Clad Laminates (CCL) use it. Heat buildup is a big problem in electronics. Efficient heat dissipation is critical. Spherical alumina powder helps solve this issue. Its round shape is important. This shape lets particles pack tightly together. Tight packing creates better pathways for heat. Heat flows more easily through the material. This improves thermal conductivity significantly. High thermal conductivity is the main goal. Spherical alumina delivers this performance. It does this better than irregular shaped fillers. The smooth surface also helps. It allows the particles to mix well with resins. Good mixing ensures even heat distribution. This prevents hot spots in the final product. EMCs encapsulate semiconductor devices. These devices generate a lot of heat. Adding spherical alumina filler helps pull heat away. It keeps the device cooler. Cooler devices run better and last longer. Reliability improves greatly. CCL forms the base for printed circuit boards (PCBs). PCBs also face heat challenges. Incorporating spherical alumina into the CCL resin helps. It enhances the board’s ability to handle heat. This is vital for high-power applications. The powder offers other benefits too. It provides good electrical insulation. Electrical properties must not be harmed. The material has high purity. Purity ensures consistent performance. It is chemically stable. Stability means it won’t react badly. Processing is easier with spherical particles. They flow smoothly during manufacturing. This leads to uniform products. Using spherical alumina is a smart choice. It directly tackles thermal issues in modern electronics.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Alumina Powder Spherical Aluminum Oxide for Thermal Conductivity Filler Used in EMC Ccl

Here are five common questions about spherical aluminum oxide powder used as a thermal conductivity filler in EMC and CCL.

Why use spherical aluminum oxide powder? The round shape helps the particles pack together tightly within the epoxy resin. Better packing means more filler material can be added. This creates a more efficient path for heat to travel away from electronic components. It prevents overheating.

How does it improve thermal conductivity? The powder acts like tiny bridges inside the material. Heat flows more easily through the dense network of spherical particles than through the resin alone. This lowers the thermal resistance. Better heat dissipation protects sensitive electronic parts.

What particle size is best? The right size depends on the specific application. Finer powders offer more surface area. They might improve conductivity but can make the mixture thicker. Larger particles flow better but need careful mixing. Manufacturers balance size for optimal performance and processability.

Is it compatible with different resins? Yes, spherical alumina powder generally works well with many epoxy resins used in EMC and CCL. It disperses evenly. This avoids clumping. Good dispersion is crucial for consistent thermal properties throughout the material.

How does it compare to other fillers? Spherical alumina often gives better thermal results than irregularly shaped mineral fillers at similar loading levels. Its shape allows higher filler content. This leads to superior heat management. It is a popular choice for demanding thermal applications.

(Alumina Powder Spherical Aluminum Oxide for Thermal Conductivity Filler Used in EMC Ccl)