Introduction of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

Boron carbide ceramics is an inorganic, non-metallic material with carbon and boron as its main components, and its chemical formula is B4C. Since its discovery in the early 20th century, this material has attracted a great deal of attention because of its unique physical and chemical properties. Boron carbide ceramics have an extremely high hardness, second only to diamond and cubic boron nitride, which makes it important in the field of wear-resistant materials. It also exhibits excellent corrosion resistance, high-temperature stability and low-density properties, attributes that make it ideal for the manufacture of bullet-proof vests, nozzles, bearings and other mechanical components that require high wear resistance. Boron carbide ceramics can also be prepared in a variety of shapes and sizes through different processes to meet the needs of different industries.

Characteristics of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

Boron carbide ceramics are known for their excellent performance characteristics, starting with their ultra-high hardness and strength, which makes them resistant to severe abrasion and scratching, making them ideal for use in cutting tools and abrasives. Secondly, the material possesses excellent chemical stability and is less likely to react with chemicals such as acids and alkalis, even in extreme environments, making it widely used in certain key components in the chemical industry. In addition, the superior thermal stability of boron carbide ceramics and their ability to maintain structural and property stability at extremely high temperatures makes them one of the key materials in the aerospace and nuclear industries. Finally, it is worth mentioning its lightweight properties, which, due to its low density, make boron carbide ceramics an ideal option for application scenarios that require light weight but high strength. Together, these characteristics give boron carbide ceramics a wide range of applications.

(High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230)

Specification of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

High purity Boron Carbide powder, known as B4C F230, is a top choice for polishing sapphire wafers. Sapphire is very hard. You need an abrasive just as hard to polish it effectively. Boron Carbide is one of the hardest materials available. It works perfectly for this tough job. This powder grade is F230. That means its particles are very fine. The typical particle size is between 30 and 40 microns. This fine size is crucial. It gives you a smooth, scratch-free finish on the sapphire surface. The powder is also high purity. We ensure purity levels are consistently above 99%. This high purity matters a lot. It prevents unwanted contamination during polishing. Contaminants can ruin the sapphire wafers. You get reliable results every time with this powder.

The hardness of Boron Carbide is its main advantage. It measures about 9.3 on the Mohs scale. Diamond is the hardest at 10. Boron Carbide is much harder than alternatives like silicon carbide or aluminum oxide. This extreme hardness means it cuts the sapphire efficiently. It removes material quickly. You save time and effort. The fine F230 particle size controls the removal rate. It prevents taking off too much material at once. This precision is key for achieving the exact surface quality needed for semiconductor or LED applications. Sapphire wafers demand this level of precision.

This Boron Carbide powder is designed for demanding industrial polishing processes. It works well in slurries. You mix it with water or other liquids. The powder disperses evenly in the slurry. This ensures uniform polishing across the entire wafer surface. Consistency is vital. Every wafer needs the same high-quality finish. Our powder delivers that consistency batch after batch. We also offer this powder in suitable packaging. It protects the product from moisture and damage during storage and transport. Handle the powder carefully. Follow standard safety procedures for fine ceramics. It is abrasive and requires proper handling gear like gloves and masks.

(High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230)

Applications of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

High purity boron carbide B4C powder F230 is a specialized abrasive material. It polishes sapphire wafers exceptionally well. This micron powder is crucial for achieving the perfect surface finish needed in high-tech applications.

Sapphire wafers are tough. They demand equally tough abrasives for efficient polishing. Boron carbide B4C is one of the hardest materials available. This hardness lets it remove material from sapphire effectively. The F230 grade refers to a specific, very fine particle size distribution. This fine size is vital. It creates the ultra-smooth, scratch-free surfaces required for advanced electronics.

The purity level is critical. High purity means minimal contamination risk. Even tiny impurities can damage sensitive electronic components built on sapphire. This powder ensures the polished wafer surface remains pristine. It prevents defects that could ruin device performance.

Semiconductor manufacturers rely on this boron carbide powder. It polishes the sapphire substrates used for LED chips. These chips need flawless surfaces to emit light correctly. The compound semiconductor industry also uses it. They polish sapphire wafers for devices like RF filters and power electronics. Precision optics benefit too. It polishes sapphire windows and lenses needing extreme clarity and durability.

The F230 particle size is controlled precisely. Consistent particle size ensures uniform material removal rates. This leads to predictable polishing results. Production becomes more efficient. Less rework is needed. Surface quality is consistent across batches. This reliability is essential for high-volume manufacturing. The powder’s properties make it indispensable for demanding sapphire finishing tasks.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230

Here are five common questions about High Purity Boron Carbide (B4C) F230 Powder for polishing sapphire wafers:

What is Boron Carbide F230 powder? It’s a very hard, man-made grit. F230 means the particles are fine, mostly around 30 micrometers. This powder is super pure, perfect for polishing sensitive materials like sapphire wafers without scratches or contamination.

Why use Boron Carbide instead of diamond powder? Diamond is harder, but much more expensive. Boron carbide is very hard too, almost as hard as diamond. It polishes sapphire well and costs less. It’s a good balance of performance and price for many wafer polishing jobs.

How pure is this powder? Our high purity grade means very few impurities, definitely less than 1%. This is critical. Impurities can scratch the sapphire surface or leave unwanted marks during polishing. High purity keeps the wafers clean and defect-free.

Is Boron Carbide safe? The powder itself isn’t highly toxic. Handle it carefully anyway. The fine dust can irritate your lungs if you breathe it in. Always wear a dust mask and gloves when working with it. Use it in a well-ventilated area or under a fume hood.

How do I use it for sapphire wafer polishing? You mix the Boron Carbide F230 powder with a liquid, like water or oil, to make a polishing slurry. The exact mix depends on your polishing machine and process. This slurry is applied to polishing pads. The machine then presses the sapphire wafer against the pad. The hard Boron Carbide particles gently remove tiny amounts of sapphire, creating a smooth, flat surface.

(High Purity Sapphire Wafers Polishing Abrasives Micron Powder Boron Carbide B4c F230)